Photolithography Engineering Manager Job in Hillsboro, Oregon US
Photolithography Engineering Manager
Photolithography Engineering Manager Engineering | Hillsboro, OR, United States Key Job Responsibilities : Job responsibilities include leading and managing a group of photolithography engineers in a high volume wafer fab. Such responsibilities include technical leadership, resource budgeting and allocation, coaching and mentoring, and occasionally leading/driving cross-functional engineering teams to solve interactive and interdependent problems to achieve continuous yield and quality improvements in a Zero Defects culture and a ?Copy Exactly!? environment. More specifically, this position is responsible for photolithographic process development and sustaining engineering for all frontend and backend processes which currently utilize steppers and proximity printers, both low and high viscosity spin-on photoresists, spin on dielectrics and laminated photoresists. The position requires working cooperatively with other engineering groups, production personnel, equipment support personnel, Operations staff and EHS personnel to achieve group, facility and corporate goals. It also requires working cross-functionally with the Supply Chain organization to manage suppliers of chemicals, reticules and equipment. Job Qualifications : 1) An MS/PhD in Chemistry, Physics or Materials Science, and at least 15 years of experience in wafer fabs and photolithographic process engineering are required. 2) Superb group leadership and management skills are required. A successful candidate will be data driven and demonstrate a sense of urgency with a passion for excellence. 3) In depth stepper expertise/understanding is required: metrology, overlay, optics and mechanics. 4) A thorough understanding of mask making procedures and reticule manufacturing processes is required. 5) Experience with photoresist spin coaters and laminators, developers, line width SEMs and effective inspection methods is required. 6) An in depth knowledge, both practical and theoretical, of photolithographic chemicals and chemistries is required. This includes their interactions with plasma etch, electroplate and other wet chemistries. 7) An advanced working knowledge of SPC and DOE, and a disciplined attitude toward their application are required. 8) Excellent verbal and written ?360 degree? communication skills are required. 9) The ability to interact effectively with production personnel, Operations staff, equipment support personnel and engineering peers in a dynamic, team based and results oriented environment is required. 10) A willingness to a) work part-time in a cleanroom wearing appropriate cleanroom attire, b) experience safe exposure to semiconductor processing chemicals and c) work flexible hours to support 24x7 manufacturing environment is required. 11) Experience in Shainin and/or Lean Six Sigma problem solving methods is highly desirable. Shainin Master or Lean Six Sigma Black Belt preferred. 12) Experience with metal liftoff processing and multi-layer photoresist processing is desirable. 13) Experience with 1:1 proximity printers is desirable. 14) A basic understanding of III-V semiconductor device physics (e.g. HBT, pHEMT, MESFET) is desirable. We?re on the Verge of Something Big. And You Can Be a Part of It! Join TriQuint in the quest to transform how the world communicates. Our RF technology is vital to taking mobile devices and networks infrastructure content to exciting new levels. We believe that innovation and great ideas come from all areas of the company. So, whether you work in manufacturing, administration or engineering, your role at TriQuint has a significant impact on this communications revolution. Our company is global, diverse and passionate about making a difference. We?ve earned recognition as one of the ?Top Ten Most Admired Technology Companies in Oregon,? and Forbes.com?s ?Most Trustworthy Companies.? Take a look around to see what we have to offer. Apply today. We?re eager to make you a part of it.