Senior Process Development Engineer Job in Itasca, Illinois Us
Knowles Electronics, a member of the Dover Corporation, is the leading global manufacturer of high performance, subminiature microphones and speakers serving the hearing health industry as well as a variety of other applications and markets (mobile communications and consumer electronics). Knowles is the pioneer of MEMS (Micro-Electro-Mechanical Systems) microphones – and is the largest producer of surface mount microphones in the world!
For more than fifty years, Knowles’ RD professionals have continually been at the forefront of subminiature acoustic technology, creating technology-driven, high quality products. At Knowles, product innovation, quality, delivery and service are our core values. Knowles’ headquarters is located in Itasca, IL and has manufacturing facilities in China and Malaysia.
Summary:
This is a position offering excellent professional and career growth in hands-on process and equipment for a growing semiconductor market. In this critical role the Process Development Engineer/Senior Engineer will have a hands-on experience in prototyping of production processes and systems, along with the improvement, proposal, design, and implementation of automation equipment.
• Responsible for defining and enabling materials and process solutions to enable new product introduction.
• Investigate new capabilities, equipment and materials to find innovative ideas for more efficient manufacturing methods.
• Drive continuous improvement initiatives for materials, process and ideas for cost reduction. Implement programs to achieve production objectives to meet quality, cost and delivery commitments.
• Work with cross functional teams to implement new products and processes to meet project cost and schedule objectives.
• Work with manufacturing sites to resolve process and materials issues.
• Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Automation Engineering, Materials Engineering or equivalent
• Industry experience in microelectronic components, semiconductor packaging, and/or PCB assembly required
• Minimum 2 years work experience in a semiconductor packaging environment with process or equipment knowledge.
• Experienced in collaborating with global manufacturing teams
• Familiarity with D.O.E., DFMEA, PFMEA and structured NPI release processes.
• Experienced in a high volume manufacturing environment is an advantage.
• Must have good oral and written communication skills
• Software skills including MS Office, Excel, statistical analysis are required
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