Sr. Packaging Engineer (RF Components) Job in San Jose 95113, California US
THE COMPANY:
Our client is actively seeking an expert Packaging Engineer to be a part of the Packaging Assembly team. The ideal candidate will be an integral member of a superb group support multiple Research Development design teams within the mobile division of our client's corporation. Candidates will be working directly with Research Development Project Managers, "front-end" "back-end" manufacturing teams, as well as define qualify enabling Packaging technologies for the company's products.
This position requires a Sr. technical specialist who can provide leadership in the development of new sustainable technology platforms for the company using a solid background in supplier management.
RESPONSIBILITIES:
- Candidates will be responsible for development of advanced packaging technologies for RF SiP applications.
- Candidates will help support selection qualification of substrate assembly suppliers. Experience with interfacing with foreign suppliers with the goal of developing improving "next generation" substrate technologies is a BIG PLUS.
- Candidates need to be able to understand Printed Circuit Board (PCB) Assembly Packaging process details, SPC, Control plans, OCAP's, FMEA's, PCN, CAR's Quality metrics. Conduct audits, benchmarking drive best practice methodologies to proactively prevent quality excursions as the technology ramps.
- Candidates will team cross-functionally with, WSD NPI Manufacturing teams support new product introduction.
- Must have experience with writing of assembly specifications, reports, production documentation
- Interact with design teams to perform design review feedback for Design for Manufacturability (DFM) design rule optimization.
- Sketch Participate in value engineering cost reduction plans.
- Create, conduct, analyze Design of Experiments (DOE) for development activities.
REQUIREMENTS:
- Our client requires a BS or MS equivalent in Mechanical, Materials, or Chemical Engineering. PhD level candidates are preferred.
- Ideal candidates will have experience with organic ceramic packages, cored coreless substrates, "lead-fee" "halogen-free" materials.
- Candidates need more than 10 years of experience in electronics packaging in related environments. Candidates with laminate fabrication backgrounds are a BIG PLUS.
- Candidates must have 5 years of direct experience in process engineering, product integration or quality management at Tier 1 assembly sub-contractors or Printed Circuit Board (PCB) suppliers.
- Candidates must have a solid technical understanding of full range of semiconductor packaging materials, die attach epoxies, solders IMC's, package material interactions, processes, dominant failure mechanisms analytical techniques.
- Candidates need good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
- Candidates must have familiarity with Printed Circuit Board (PCB) design layout tools as well.
- Candidates need a strong understanding of package qualification reliability methods as well as failure analysis expertise.
- Candidates must have a strong understanding of statistics, control methodology, FMEA's. A background in analytical trouble shooting in a factory environment is also required.
- Candidates must have excellent English communication skills.
- Candidates must also be willing to travel internationally, typically once per quarter.
If interested in this excellent opportunity, please send your resume in a word attachment to: Jason@OneTenTech.com
REFERRAL BONUS
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Have a great day and we look forward to hearing from you soon!