SUBSTRATE DESIGN ENGINEER Job in Shenzhen
SUBSTRATE DESIGN ENGINEER #1426405
RESPONSIBILITIES:
- Bump, RDL and Substrate Interconnect Design for latest GPU and Tegra Chip.
- PCB design for latest Graphic Card and Mobile devices (Tablet, Superphone, GPS)
- Signal and Power integrity analysis for Substrate and PCB design
- Substrate and PCB DFM, DFA analysis
- Substrate design tools and design flows optimization and development.
MINIMUM REQUIREMENTS:
- BS or above in Electronics packaging, EE, Signal integrity or related area.
- Strong knowledge on the circuit theory, especially for analog circuit design
- Can do attitude
- Must be a team player with effective English written and verbal communication skills.
- High energy, be able to learn quickly and work independently.
- Knowledge on High speed interconnects design and simulation.
- Knowledge on PC architecture
- Knowledge on PCB material, fabrication and assembly
- Knowledge on IC Package Material, Manufacture and Assembly is preferred.
- knowledge on Substrate design is preferred
Interested in talking with us? Please apply directly at NVIDIA.COM