Design Engineering Intern (m/f)
Design Engineering Intern (m/f)
2043BR
Texas Instruments High Speed Signal Path (HSSP) Group is continuing to invest in the design and production release of state-of-the art Gigahertz ADCs, both as cores and stand-alone products. The most recently released product is a 12-bit ADC, configurable as either a dual 1.8 GSPS part, or as a 3.6 GSPS single. This remarkable performance was achieved despite the use of a 0.18um CMOS technology.
The analog design position will support our shift towards more aggressive technologies, to extend the performance of these converters in either BiCMOS or smaller geometry CMOS. In addition, design work for products with higher levels of integration and functionality may be required. The initial assignment for this position will be assisting a senior engineer on an existing program, with responsibilities depending on the candidate’s experience. As part of any product release, the designer is expected to participate in the complete product development cycle: product definition, circuit design, custom layout generation and/or layout supervision, silicon evaluation and debug, and careful documentation. Since the support organization outside of design is in the US, regular meetings in English which start late in our working day can be expected.
Your Qualification:
- First Analog design experience.
- Solid Knowledge of Cadence design entry (or similar) software.
- First Experience with SPECTRE or a similar circuit simulation program.
- Familiarity with UNIX environment.
- Fluent in English.
- Ability to manage complex problems and apply creativity for their solution.
Our offer:
• An attractive compensation benefits package.
• A flexible, informal and open-minded work culture.
• A performance-oriented environment that provides great rewards for great work.
• A world of opportunities for your personal development.
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