Design Engineering Intern (m/f)

 Design Engineering Intern (m/f)2043BR  Texas Instruments High Speed Signal Path (HSSP) Group is continuing to invest in the design and production release of state-of-the art Gigahertz ADCs, both as cores and stand-alone products. The most recently released product is a 12-bit ADC, configurable as either a dual 1.8 GSPS part, or as a 3.6 GSPS single. This remarkable performance was achieved despite the use of a 0.18um CMOS technology.The analog design position will support our shift towards more aggressive technologies, to extend the performance of these converters in either BiCMOS or smaller Read more […]

June 25, 2010 • Tags: , , , • Posted in: General • Comments Off on Design Engineering Intern (m/f)