SUBSTRATE DESIGN ENGINEER Job in Shenzhen
SUBSTRATE DESIGN ENGINEER #1426405RESPONSIBILITIES:- Bump, RDL and Substrate Interconnect Design for latest GPU and Tegra Chip.- PCB design for latest Graphic Card and Mobile devices (Tablet, Superphone, GPS)- Signal and Power integrity analysis for Substrate and PCB design- Substrate and PCB DFM, DFA analysis- Substrate design tools and design flows optimization and development.MINIMUM REQUIREMENTS:- BS or above in Electronics packaging, EE, Signal integrity or related area.- Strong knowledge on the circuit theory, especially for analog circuit design- Can do attitude- Must be a team player with Read more […]
October 6, 2010
• Tags: SUBSTRATE DESIGN ENGINEER Job in Shenzhen • Posted in: General • Comments Off on SUBSTRATE DESIGN ENGINEER Job in Shenzhen